PRA USA Raleigh, NC, USA
Jul 18, 2019Full time
Packaging Manager-Power Devices Raleigh, NC Job Summary of the Packaging Manager-Power Devices: Packaging Manager with Power Devices experience is required to play a key role in managing the package portfolio of silicon carbide discrete power components for one of our clients in the NC. This client is a very stable and rapidly growing company, they are dedicated to engineering stuff and growing at a faster rate. In this role you will be responsible for supporting development of a large portfolio of discrete power components and Optimizing leading-edge processes for die attach, wire bonding, and plastic over-molding. If you have 4+ years of experience in packaging of power transistors along with automotive-qualified components, then this position is well suited to you Responsibilities of the Packaging Manager-Power Devices: Manage and grow the department to expand the package portfolio and development of silicon carbide discrete power components Collaborate with subcontractors to leverage their in-house capabilities for use with silicon carbide Adapt processes and develop new capabilities to take advantage of the power density of silicon carbide Optimize leading-edge processes for die attach, wire bonding, and plastic over-molding Explore and develop use of new materials and capabilities to meet increasing demands for ruggedness and reliability for automotive applications Develop required modeling capabilities Drive development of robust DFMEA, PFMEA and Control Plans in development stages to deliver to Operations Establish manufacturing control plans to assure quality and consistency to IATF and AEC-Q101 standards for automotive-grade components Work closely with all functional stakeholders (Marketing, Engineering, and Manufacturing) across global sites to develop a clear definition for projects ensuring they meet market requirements and internal company goals Participate in all product-launch Gate Reviews with the New Product Introduction (NPI) and Product Marketing teams to understand all performance and reliability requirements Manage capital and personnel budgets to support rapid business growth Qualifications of the Packaging Manager-Power Devices: BS in Engineering, Material Science or related stream 4+ years of experience in packaging of power transistors Experience with qualification of surface mount packages and automotive-qualified components Awareness of failure mechanisms in power packages Experience with Engineering management and Power semiconductor device test Experience in dealing with subcontractors Knowledge of semiconductor component qualification and reliability testing Compensation of the Packaging Manager-Power Devices: Salary Range: $125000-$140000/ year, depending on experience Location: Raleigh, NC Type: Direct Travel: As and when required. Relocation Assistance: No Visa Sponsorship: H1B transfers only. NO OPT will be considered Knowledge of the following areas may be helpful:- Packaging, "Power Devices", "silicon carbide discrete power", SiC, MOSFETs, "die attach", "wire bonding", molding, DFMEA, PFMEA, IATF, AEC-Q101", "New Product Introduction", NPI, "power transistors", "surface mount", semiconductor, "reliability testing"